Modeling the reflow soldering process in PCB'S

By Costa, J.; Soares, D.; Teixeira, S.F.; Cerqueira, F.; Macedo, F.; Rodrigues, N&p

ASME 2015 International Technical Conference and Exhibition on Packaging and Integration of Electronic and Photonic Microsystems, InterPACK 2015, collocated with the ASME 2015 13th International Conference on Nanochannels, Mi



No abstract available.

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