Characterization of high-resistivity polycrystalline silicon substrates for wafer-level packaging and integration of RF passives

By Bartek, M.; Polyakov, A.; Sinaga, S.M.; Mendes, P.M.; Correia, J.H.; Bur

ASDAM 2004 - Conference Proceedings, 5th International Conference on Semiconductor Devices and Microsystmes

2004

Abstract

No abstract available.

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